SIMCom, Infineon and Kigen Deliver Smallest eSIM-enabled Module

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SIMCom, Infineon and Kigen Deliver Smallest eSIM-enabled Module

Machine-to-Machine wireless modules and solutions designer SIMCom announced an eSIM-enabled Module that is only 24 mm x 24 mm tall. The NB-IoT SIM7070 module can now be equipped with a compact eSIM security controller from Infineon powered by GSMA-compliant remote SIM management software provided by Kigen (UK) Ltd. The security controller comes in the smallest SMD package It is significantly smaller than the standard currently established.

eSIM and Remote SIM Provisioning (RSP) technology relieve a major bottleneck in at-scale device deployment for massive IoT. Instead of using a physical SIM to send the data required to connect to the network, eSIM enables remote SIM provisioning of cellular connected devices. This brings advantages to consumer electronics, home IoT applications and IIoT-applications such as smart metering, and asset tracking.

IoT equipment is getting smaller but has more functions, which presents a big challenge to the module supplier. Thanks to the cooperative effort with Infineon and Kigen, SIMCom’s NB-IoT module SIM7070 family now supports the option of embedding a miniaturized eSIM and facilitate integration, and logistics while reducing costs of manufacturing secure by design goods at scale.

says Yang Tao, Chairman of SIMCom.
SIMCom SIM7070 series is an NB-IoT module supporting wireless communication modes of Cat-M/Cat-NB/GPRS/EDGE. Among its interfaces are UART, GPIO, PCM, SPI, I2C, etc. The SIM7070 series has been used in metering tracker and other various scenes which need low latency, low-throughput data communication in a variety of radio-propagation conditions.
The SLM17 32-bit eSIM security controller from Infineon, embedded in a miniaturized SMD package measuring 2 mm x 2 mm in a SIM7070 module, is optimized for the demands of cellular IoT applications, and can work at a temperature range from -40 to 105°C. Thanks to highly robust NVM technology and resistance to harsh environmental conditions, SLM17 supports a lifetime in excess of 10 years, retains data for more than 10 years and boasts low failure rates.
“The deployment of 5G and the move towards the cloud and virtualization are reshaping operations and practices in the industry. We support this transformation through collaborations like this, eliminating the SIM integration effort for SIMCom customers and MNOs. At the same time, we are meeting pressing industry demands for scalability, easy deployment and widescale coverage,” says Juergen Rebel, Senior Vice President and General Manager Embedded Security at Infineon.

One barrier to scaling IoT is the complexity device makers face in accessing readily available hardware, and especially so with low-power cellular IoT. Thus, the collaboration with SIMCom and Infineon brings together all elements in a way that allows even the smallest devices to get connected with ease and at scale. With Kigen’s GSMA-certified eSIM OS and remote SIM provisioning services, device makers can manufacture a single product to win new customers in new geographies and work with their preferred connectivity networks.

says Vincent Korstanje, CEO of Kigen.eSIM-enabled Module

Author: Rainer Claaßen
Image Credit: SIMcom

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